TONG COLIN XINGCUN <br/><br/>
ADVANCED MATERIALS FOR THERMAL MANAGEMENT OF ELECTRONIC PACKAGING 

 - SPRINGER  2011 
<br/><br/><label>ISBN: </label>978-1-4419-7758-8 
<br/><br/><label>ISSN: </label>1437-0387 
<br/><br/><label>LC Class. No.: </label>2