ADVANCED MATERIALS FOR THERMAL MANAGEMENT OF ELECTRONIC PACKAGING

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TextPublication details: SPRINGER 2011ISBN:

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Holdings
Item type	Current library	Collection	Call number	Copy number	Status	Barcode
Long Loan Book	Kisii University Library	Science & Technology	TK 7870.15 T66 2011 (Browse shelf(Opens below))	C.2	Available	000000006595

Previous	No cover image available	No cover image available	No cover image available		No cover image available	No cover image available	No cover image available	Next
Previous	TK 7868 T63 1995 DIGITAL SYSTEMS: PRINCIPLES AND APPLICATIONS	TK 7868 T65 2003 DIGITIAL ELECTRONICS: PRINCIPLES AND APPLICATIONS	TK 7868 T65 2003 DIGITIAL ELECTRONICS: PRINCIPLES AND APPLICATIONS	TK 7870.15 T66 2011 ADVANCED MATERIALS FOR THERMAL MANAGEMENT OF ELECTRONIC PACKAGING	TK 7871 A73 2009 ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS	TK 7871 S58 2013 LINEAR INTEGRATED CIRCUIT	TK 7871.15 C4 A38 2010 ADVANCES IN ELECTRONIC CERAMICS II	Next

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